2001 SYMPOSIUM
DAILY AGENDAS
Please use the following links for each
day's schedule and details on the papers to be presented within each of the
three tracks of the Symposium.
- Monday, May 7, 2001,
Tutorials, Plenary and Sessions
- Tuesday, May 8,
2001
- Wednesday, May
9, 2001
Conference
at a Glance
MONDAY, 7 MAY 2001
8:30am – 12:00pm
TUTORIALS &
WORKSHOPS
- Life Cycle Assessment and Design for
Environment: Useful Electronics Applications
- Harald Florin, PE Group
- Andrea Russell, Five Winds
International
- Transition to Lead-Free Solder in
Electronics
- Karl J. Puttlitz, IBM Corporation
- Kathleen A. Stalter, IBM Corporation
- Mohammad Yunus, Texas Instruments
- Carol Handwerker, National Institute of
Standards and Technology
- International and Domestic Regulatory
Product Requirements for the Electronic Sector
- Paul Hagen, Beveridge & Diamond, P.C.
- Holly Evans, Electronic Industries Alliance
- Industry Representative to be determined
12:00pm – 1:00pm
LUNCH FOR MONDAY
SPEAKERS
1:15p.m. – 2:15p.m.
Plenary Speaker
Wayne S. Balta, Director, Corporate
Environmental Affairs, IBM Corrporation
2:30 p.m. - 4:30 p.m.
Session 1
DFE Methodology & Tools I
A User-Friendly Design for
Environment Tool
- Anke Thomassen, Delft University of Technology
- Jaco Huisman, Delft University of Technology
- Ab Stevels, Delft University of Technology
- Han Brezet, Delft University of Technology
- Joost Prins, Delft University of Technology
- Tom van der Horst, Dutch Organization for
Applied Scientific Research (TNO)
Material Cycling in
Industrial Systems: Measurement, Dependency Analysis, and Casual Closure
- Reid Bailey, University of Dayton
- Janet K. Allen, Georgia Institute of
Technology
- Bert Bras, Georgia Institute of Technology
Disassembly Complexity and
Recyclability Analysis of New Design from CAD File Data
- Vishakar Mani, New Jersey Institute of
Technology
- Sanchoy K. Das, New Jersey Institute of
Technology
- Reggie Caudill, New Jersey Institute of
Technology
The DFE Workbench:
Methodology and Case Study
- Elena Man, CIMRU
- Jimmie Browne, CIMRU
- Thomas Roche, Galway Mayo Institute of
Technology
2:30 p.m. - 4:30 p.m.
Session 2
Manufacturing Processes I
The Quest for Environmental
and Productivity Improvements at IBM's Demanufacturing Operation and Asset
Recovery Center
- Edward Grenchus, IBM Corporation
- Robert Keene, IBM Corporation
- Charles Nobs, IBM Corporation
- Larry Yehle, IBM Corporation
Flexible Disassembly Tools
- G. Seliger, Technical University Berlin
- U. Rebafka, Technical University Berlin
- A. Stenzel, Technical University Berlin
Product Recovery Using a
Disassembly Line: Challenges and Solution
- Surendra M. Gupta, Northeastern University
- Askiner Gungor, Pamukkale University
Cathode Ray Tube
Manufacturing and recycling: Analysis of EIA Survey
- Amanda Monchamp, Electronic Industries
Alliance
- Joe Nardone, Techneglas
2:30 p.m. - 4:30 p.m.
Session 3
Corporate Strategies for
Environmental Performance
Product Environmental Care, A
Praxis-based system uniting ISO 14001, ISO 14062, IPP, EEE and Eco Label
Elements
- Ab Stevels, Delft University of Technology
Product and Process Life
Cycle Inventories using SAP R/3
- Antje Januschkowetz, Robert Bosch GmbH
- Chris T. Hendrickson, Carnegie Mellon
University
An IBM Methodology for
Evaluating Emerging Requirements
- Bradford Brooks, IBM Corporation
- Mary Ann Christie, IBM Corporation
- Mary Jacques, IBM Corporation
- J. Ray Kirby, IBM Corporation
- Tim Mann, IBM Corporation
Stakeholder Dialongues on
Recycling Engineering Thermoplastics: A Collaborative Effort to Build a
Recycling Infrastructure for Plastics from Electronics
- Patricia S. Dillon, Gordon Institute at Tufts
University
4:30 p.m. - 5:30 p.m.
ROUNDTABLE DISCUSSIONS
TUESDAY,
8 MAY 2001
8:30a.m. – 9:45a.m.
KEYNOTE ADDRESS
- Jonathan G. Koomey, Staff Scientist,
Lawrence Berkeley National Laboratory
10:00 a.m. - 12:00 p.m.
Session 4
DFE Assessment Methods
Ranking Ecodesign Priorities
from Quantitative Scenario Uncertainty Assessment for End-of Life Scenarios
- Casper Boks, Delft University of Technology
- Ab Stevels, Delft University of Technology
Optimization of RFID
Technology for Product Management
- Steve Chen, Princeton University
Toxicological Assessment of
the End-of-Life of Consumer Electronic Products using Different
Environmental Assessment Models
- Jaco Huisman, Delft University of Technology
- Ab Stevels, Delft University of Technology
- Andreas Middendorf, Fraunhofer IZM
Comparison of Major
Environmental Performance Metrics and Their Application to Typical
Electronic Products
- Yanchun Luo, New Jersey Institute of
Technology
- Pornsarun Wirojanagud, New Jersey Institute
of Technology
- Chatpet Yossapol, New Jersey Institute of
Technology
10:00 a.m. - 12:00 p.m.
Session 5
End of Life Strategies
Metrics for End-of-Life
Strategies (ELSEIM)
- Catherine M. Rose, Delft University of
Technology
- Ab Stevels, Delft University of Technology
End of Life Recycling through
Free Enterprise
- Douglas Smith, Sony Electronics Inc.
- Mark Small, Sony Electronics Inc.
An Overview of IBM Product
Takeback Programs: "Considerations for Commercial and Consumer Returns"
- J. Ray Kirby, IBM Corporation
- Rhea Hale, IBM Corporation
- Timothy Mann, IBM Corporation
- Dewey Pitts, IBM Corporation
A logistic concept to improve
the re-usability of electric and electronic equipment
- R. Knoth, Austrian Society for Systems
Engineering and Automation
- M. Hoffmann, Austrian Society for Systems
Engineering and Automation
- B. Kopacek, Austrian Society for Systems
Engineering and Automation
- P. Kopacek, Austrian Society for Systems
Engineering and Automation
10:00 a.m. - 12:00 p.m.
Session 6
Life Cycle Impact Assessment
Life-Cycle Environmental
Impacts of CRT and LCD Desktop Monitors
- Maria Leet Socolof, University of Tennessee
- Jonathan Overly, University of Tennessee
- Lori Kincaid, University of Tennessee
- Rajive Dhingra, University of Tennessee
- Dipti Singh, US EPA
- Katherine Hart, US EPA
Environmental Impact of an
Integrated Circuit
- Patrizia Fea, CSELT
- Claudio Papuzza, CSELT
- Fulvio Taiariol, CSELT
- R. Casalino, Politecnico di Torino
- E. Galbiati, STMicroelectronics Srl
- S. Zappa, STMicroelectronics Srl
Energy Consumption of
Cellular Telephones
- Ion V. Nicolaescu, Motorola Aadvanced
Technology Center
- William F. Hoffman, Motorola Aadvanced
Technology Center
Life Cycle Profitability
Analysis and LCA by Simulating Material and Money Flows
- Takeshi Murayama, Hiroshima University
- Shinya Hatakenaka, Hiroshima University
- Norihiko Narutaki, Hiroshima University
- Fuminori Oba, Hiroshima University
12:00 p.m. – 1:45 p.m.
LUNCHEON ADDRESS
Speaker TBD
2:00 p.m. – 3:30 p.m.
PANEL: E-commerce
Panel Members:
H. Scott Matthews Carnegie Mellon University
Reggie Caudill New Jersey Institute of Technology
TBD Ford
3:45 p.m. - 5:15 p.m.
Session 7
DFE Methodology & Tools II
Life Cycle Inventory Analysis
and Identification of Environmental Hot Spots in Semiconductor Manufacturing
- Karsten Schischke, Technische Universität
Berlin
- Herbert Reichl, Technische Universität
Berlin
- Markus Stutz, Motorola GmbH
- Hansjörg Griese, Fraunhofer Institut fur
Zuverlässigkeit und Mikrointegration
- Jean-Paul Ruelle, Motorola SA
A System for Integrating
Design for Environment (DfE) Criteria into the New Product Introduction
Process
- Tom L. Neal, Hewlett-Packard
- Mark Heintz, Hewlett-Packard
Environmentally Conscious
Modular Design for Electromechanical Products
- Xueqing Qian, Texas Tech University
- Tu Yu, Texas Tech University
- Hong C. Zhang, Texas Tech University
3:45 p.m. - 5:15 p.m.
Session 8
Advanced Electronic Technologies & Modeling
Remanufacturing - the Key
Solution for Transforming "Downcycling" into "Upcycling"
of Electronics
- Rolf Steinhilper, Fraunhofer Institute for
Manufacturing Eng & Automation
Fuzzy Reasoning Petri Nets
for Disassembly Processes
- Meimei Gao, New Jersey Institute of Technology
- MengChu Zhou, New Jersey Institute of
Technology
A Systematic Approach to
Disassembly Line Balancing
- Ying Tang, New Jersey Institute of Technology
- MengChu Zhou, New Jersey Institute of
Technology
- Reggie J. Caudill, New Jersey Institute of
Technology
3:45 p.m. - 5:15 p.m.
Session 9
Analysis of the Impacts of E-everything
Web-Based Tool for Estimating
the Environmental Impacts of Teelcommuting
- Erasmia Kitou, University of California at
Berkeley
- Eric Masanet, University of California at
Berkeley
- Arpad Horvath, University of California at
Berkeley
Network-based Simulation and
Optimization of Sustainable E-Supply-Chain Management for Electronic
Products
- Yanchun Luo, New Jersey Institute of
Technology
- Pornsarun Wirojanagud, New Jersey Institute
of Technology
- Reggie J. Caudill, New Jersey Institute of
Technology
The Net Effect: Environmental
Implications of E-Commerce and Logistics
- H. Scott Matthews, Carnegie Mellon University
- Chris Hendrickson, Carnegie Mellon University
- Lester Lave, Carnegie Mellon University
- Denise Soh, Carnegie Mellon University
WEDNESDAY,
9 MAY 2001
8:00 a.m. - 9:30 a.m.
Session 10
DFE in Practice
Product Ecology at a Leading
OEM Supplier - Intel Corporation
- Todd Brady, Intel Corporation
- Nancy Sumrall, Intel Corporation
- Allen Frishman, Intel Corporation
- Ryan Howell, Intel Corporation
ADSM - Active Disassembly
using Smart Materials
- N. Warburg, University of Stuttgart
- C. Herrmann, University of Stuttgart
- Joseph David Chiodo, Brunel University
The Evolution of Design for
Environment in Electronics Firms
- James Fava, Five Winds International
- Duncan Noble, Five Winds International
- Andrea J. Russell, Five Winds International
8:00 a.m. - 9:30 a.m.
Session 11
Advancing Electronic Technologies & Modeling
Evaluation of End-of Life
(EOL) Take Back Implementation Models in Various Countries in Europe
- K.G. Hieronymi, Hewlett-Packard Europe
Value Added Color Sorting of
Recycled Plastic Flake from End-Of-Life Electrical and Electronic Equipment
- Brian Riise, MBA Polymers
- Trip Allen, MBA Polymers
- Michael B. Biddle, MBA Polymers
- Michael M. Fischer, American Plastics Council
Economic and Logistical
Modeling for Regional Processing and Recovery of Engineering Thermoplastics
- Cynthia F. Murphy, University of Texas at
Austin
- Patricia S. Dillon, Tufts University, MA
- Greg Pitts, Ecolibrium
8:00 a.m. - 9:30 a.m.
Session 12
Closed Loop Supply Chain Management
Improving Environmental
Performance Through Reverse Logistics at IBM
- E.J. Grenchus, IBM Corporation
- S.N. Johnson, IBM Corporation
- D.W. McDonnell, IBM Corporation
Overcoming Supply Chain
Challenges: Advancing IBM's Environmentally Conscious Product Program
Targets
- Steve Ching, IBM Corporation
- Mary Jacques, IBM Corporation
- J. Ray Kirby, IBM Corporation
- Dewey Pitts, IBM Corporation
- Inder Wadehra, IBM Corporation
The DBOM Standard: A
Specification for Efficient Product Data Transfer Between Manufacturers and
Demanufacturers
- Sanchoy K. Das, New Jersey Institute of
Technology
- Sandeep Naik, New Jersey Institute of
Technology
9:45 a.m. - 11:45 a.m.
Session 13
DFE Metrics & Implementation
Natural and Economic Carrying
Capacity Estimates for Assessing Environmental Performance &
Sustainability at the Firm and Product Level
- C. Yossapol, New Jersey Institute of
Technology
- Y. Luo, New Jersey Institute of Technology
- P. Wirojanogud, New Jersey Institute of
Technology
- D.J. Watts, New Jersey Institute of Technology
- L. Axe, New Jersey Institute of Technology
- D.A. Dickinson, Lucent Technologies
- J.A. Mosovsky, Lucent Technologies
Assessing Product Design
Alternatives with Respect to Environmental Performance &
Sustainability: A Case Study for Circuit Pack Face Plates
- J.A. Mosovsky, Lucent Technologies
- J.A. Dispenza, Lucent Technologies
- D.A. Dickinson, Lucent Technologies
- J.M. Morabito, Lucent Technologies
- R.J Caudill, New Jersey Institute of
Technology
- N. Alli, New Jersey Institute of Technology
Environmental Supply Chain
Management - From Strategy to Implementation
- Steven B. Young, Five Winds International
- Duncan Noble, Five Winds International
- Andrea J. Russell, Five Winds International
Intelligent Disassembly of
Electronic Equipment
- M. Hoffmann, Austrian Society for Systems
Engineering and Automation
- R. Knoth, Austrian Society for Systems
Engineering and Automation
- B. Kopacek, Austrian Society for Systems
Engineering and Automation
- P. Kopacek, Austrian Society for Systems
Engineering and Automation
9:45 a.m. - 11:45 a.m.
Session 14
Product Reuse & Recycling
Method to Assess the
Recyclability of Televisions from the Perspective of Consumer Organizations
- K.H.P. Janssen, TNO Institute of Industrial
Technology
- T.J.J. van der Horst, TNO Institute of
Industrial Technology
LCA Analysis of a
Telecommunication Service
- Patrizia Fea, CSELT
- Claudio Papuzza, CSELT
- Fulvio Taiariol, CSELT
- A. Ramella, Politecnico di Torino
Comparison of Remanufacturer
Waste Streams for Electronic Products
- Joy Williams, University of Toronto
- Li Shu, University of Toronto
Reliablility of Lead Free
Sloder joint by using CSP (Chip Size Package)
- Takanori Hirano, Sony Corporation
- Keiki Fukuda, Sony Corporation
- Kazuhiro Ito, Sony Corporation
- Tomaya Kiga, Sony Corporation
- Yoshikuni Taniguchi, Sony Corporation
9:45 a.m. - 11:45 a.m.
Session 15
Environmental Analysis of Electronic Materials
Lead-free Soldering -
Toxicity, Energy and Resource Consumption
- O. Deubzer, University of Tokyo
- T. Suga, University of Tokyo
- H. Griese, Fraunhofer IZM
The Development of Lead-Free
Printed Circuit Assembly Technology in Hewlett-Packard: Our Strategy and
Experience
- Greg Henshall, Hewlett-Packard Co.
- Lisa Lindsley, Hewlett-Packard Co.
Eco-comparison Between
Ceramic and Epoxy Based Populated PWBs
- C. Herrmann, University of Stuttgart
- J. Gediga, University of Stuttgart
- N. Warburg, University of Stuttgart
Survey of Alternatives to
Tin/Lead Solder and Brominated Flame Retardants
- Cynthia F. Murphy, University of Texas at
Austin
- Greg Pitts, Ecolibrium
Raymond P. Lizotte, Jr.
IEEE ISEE Website.
Revised: January
23, 2001.